Nordson ASYMTEK Introduces New High-Speed, High-Accuracy, Precision Fluid Dispensing System for Cleanrooms
The award-winning Spectrum II family of fluid dispensers has a small footprint of only 600mm wide, maximizing floor space and productivity for high-volume production environments. The modular design allows for easy adaptation and upgrading to accommodate new applications and production requirements. The Cleanroom Series includes features like a stainless steel system enclosure for easy wipe-down and maintenance and ULPA filter for down-flow ventilation for work-piece cleanliness. New Fluidmove?v6.0 software features (running on Windows?7 Operating System) reduce operator dependency and training requirements to achieve consistent machine-to-machine performance.
Extremely accurate and repeatable X-Y dispensing enables smaller keep-out-zones (KOZs) to accommodate high-density packages, while precision Z-axis control enables tighter dispense gaps for thinner lines and smaller dots. The dispensing system offers many built-in closed-loop process controls such as an integrated weight scale, software-controlled fluid and pressure regulators, the capability to manage up to six heating stations, and patented calibrated process jetting (CPJ) and mass flow calibration (MFC) to automatically ensure volumetric repeatability during long production runs. These controls guarantee a reliable dispensing process that maximizes the total cost of ownership.
hen dispense location, weight, and volume are critical in particle-sensitive applications, there are no better fluid dispensers on the market than the Spectrum II cleanroom systems,?said Garrett Wong, Spectrum Series product manager, Nordson ASYMTEK. "You won't need to purchase completely new equipment when production needs change because these flexible, scalable systems can be configured with options and features, such as pre- and post-queue stations, dual valve dispensing, and tilt jetting, to stretch your capital equipment dollars.?
The Spectrum II Cleanroom Series is ideal for dispensing processes that are often done in a cleanroom such as wafer-level underfill dispensing, 3D packaging, chip encapsulation, dam and fill, dispensing thermal compounds, and MEMS wafer capping.
Nordson ASYMTEK will be exhibiting at SEMICON West, Moscone Center, San Francisco, CA from July 8-10, 2014 in booth 5743. Contact Nordson ASYMTEK to make an appointment to discuss your application. For more information contact Garrett Wong at info@nordsonasymtek.com website at www.nordsonasymtek.com.
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