Products
512Mb (8Mx4Banks×16) DDR2 SDRAM
H2A35121656B
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Description
The chip is designed to comply with the following key DDR2 SDRAM features:
- posted CAS with additive latency,
- write latency = read latency -1,
- Off-Chip Driver (OCD) impedance adjustment and On Die Termination
- normal and weak strength data output driver.
All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 512 Mb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ.
Available package:TFBGA-84Ball.
Features
- JEDEC Standard VDD/VDDQ = 1.8V±0.1V.
- All inputs and outputs are compatible with SSTL_18 interface.
- Fully differential clock inputs (CK, /CK) operation.
- Four Banks
- Posted CAS
- Bust length: 4 and 8. Programmable CAS Latency (CL): 3, 4, 5, 6 & 7.
- Programmable Additive Latency (AL):0, 1, 2, 3, 4, 5 & 6.
- Write Latency (WL) =Read Latency (RL) -1.
- Read Latency (RL) = Programmable Additive Latency (AL) + CAS Latency (CL)
- Bi-directional Differential Data Strobe (DQS).
- Data inputs on DQS centers when write.
- Data outputs on DQS, /DQS edges when read.
- On chip DLL align DQ, DQS and /DQS transition with CK transition.
- DM mask write data-in at the both rising and falling edges of the data strobe.
- Sequential & Interleaved Burst type available.
- Off-Chip Driver (OCD) Impedance Adjustment
- On Die Termination (ODT)
- Auto Refresh and Self Refresh
- 8,192 Refresh Cycles / 64ms
- Average Refresh Period 7.8us at lower than Tcase 85 °C, 3.9us at 85°C < Tcase ≦ 95°C
- RoHS Compliance
- Partial Array Self-Refresh (PASR)
- High Temperature Self-Refresh rate enable
About Us
Hwaling Technology, headquartered in Taipei, Taiwan, stands as a pioneering force in the production of DRAM IC in Taiwan. Renowned for its commitment to innovation and the promotion of its proprietary brand, Axeme, HwaLing continuously explores new applications in DRAM and FLASH products. In an era where the convergence of Communication, Electronic Consumer, and Computing devices has become ubiquitous in the lives of consumers, Hwaling leverages its extensive experience in the memory field to deliver top-tier products and services.
Our product portfolio predominantly revolves around Flash Memory and Storage Products, encompassing Flash Memory Cards, DRAM Modules, and Semiconductor Components tailored for these products. Aligned with the ever-evolving landscape of consumer electronics, our offerings cater to an array of gadgets such as OTG Flash Drives, SSDs, UFDs, Mobile Phones, Tablets, Car Camcorders, TV Boxes, Routers, PDAs, Notebooks, PCs, Smartphones, and photo viewers, providing comprehensive solutions for diverse applications.
At Hwaling, we pride ourselves on our unwavering commitment to quality, driven by a passion for technological excellence. As we navigate the dynamic intersection of innovation and consumer demands, our focus remains steadfast on delivering cutting-edge products and solutions that elevate the user experience across a spectrum of devices. Embrace the future of memory technology with Hwaling, where innovation meets reliability, and your satisfaction is our priority.
Business Type: Manufacturer/OEM
Main Products
Memory IC, Memory Module, DRAM IC, Flash IC, eMMC, RAM, Low Power, DDR, Chip, Chip Component, Mirco SSD, Flash Memory, Flash Memory Card, DRAM Module, Semiconductor Component