Powertronics Co.,Ltd.Taiwan

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1410187-3(MALE)、 1410142-1(FEMALE)

Description :
MULTIGIG RT product is a backplane interconnect family that offers levels of flexibility and customization never before seen in the industry. This printed circuit based, pinless, interconnect family is comprised of modular components which can be used in a variety of combinations. The connectors in this innovatively flexible platform can be combined to provide the density, data throughput, and signal integrity required for any application in today's computer, communications, military, medical, or industrial control industries.
The use of printed circuit wafers in this connector system allows for cost effective sequencing and electrical customization of the connector. Wafers can be manufactured specifically for differential or signal ended performance and the impedance, propagation delay, and crosstalk of the connector can be altered per customer requirements. This scalable board to backplane connector family is a robust, ""pinless"" design which eliminates the pin field on backplane boards and reduces the end user's exposure to field failure in card cage systems.

The MULTIGIG RT 2 interconnect was selected for the VITA 46 VPX standard for rugged embedded computing applications. MULTIGIG RT 2-R connectors offer a quad-redundant backplane contact and ruggedized guide hardware to withstand extreme vibration environments.

  • Aerospace and defense
  • Telecommunications equipment
  • Midrange servers
  • High end servers
  • High-speed custom platforms
  • Mass data storage
  • Rugged, mission-critical applications
  • Switches
  • Servers/Blade Servers
  • Routers
  • Storage
  • Features :
    Up to 6.25 Gb/s performance
    Density available in 2 versions per tier: 0.8"" and 1"", respectively fitting 20.32 mm (0.8"") and 25.4 mm (1"") slot-pitches
    Backplane connector system specified in VME standards: VXS (VITA 41) & VPX (VITA 46)
    Pinless backplane connector utilizes a PCB construction which allows the connector system to have extreme flexibility. 100 Ohm differential, 50 Ohm single ended, open pin field, and power wafers can be mixed within one connector module.
    Specification :
    Customizable impedance matched printed circuit wafer interface
    Inverse sex backplane connector system with “pinless” interface
    Superior crosstalk performance
    Optimized footprints for signal integrity and ease of board design
    Utilizes a 0.56 [.022] diameter via for lower cost board fabrication
    Three levels of signal contact sequencing
    Telcordia/Bellcore compliant
    Available in modular or monoblock style
    Available for 20.30mm [0.8] or 25.40mm [1.0] card pitch systems
    Durability rated for 200 Cycles
    Fully compatible with MP based fiber optic array interconnects
    Guide hardware available that meets the VITA 41 and/or VITA 46 standards
    Complete connector family includes power modules, guidance modules and cable assemblies

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