This site uses cookies to provide you with a better experience. For information on our Privacy and Cookie Policy, please visit this page. By continuing to use the site or closing this banner, you are agreeing to our terms of use. Close
Multi-layer boards manufactured by Build Up process and blind/ buried via Micro-via, to achieve the characteristics of high-density wiring.
Micro-hole design (aperture <0.15mm), high wiring density
The minimum line width/ spacing for mass production is 0.076/ 0.076mm, and the sample line can reach 0.076/ 0.076mm.
Variety of stacking structure, 1~26 layers can be processed (including Any-Layer), processing board thickness 0.25~4.0mm.
Diversified selection of raw materials, mainly halogen-free environmentally friendly materials.
HDI Application:
HDI PCB high-density connection board, currently can produce multi-level ANY LAYERS.
Application areas: NB, Tablet Computers, Digital Cameras, Automotive Electronics.
Industrial Computer Products
Currently, there is no product exhibited. Please select another subcategory to view product details.