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Elite Semiconductor Microelectronics Technology Inc.

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ESMT joins 2023 China International IC Industry and Application Expo (IC Expo)

2023/11/11

Elite Semiconductor Microelectronics Technology Inc.
No.23, Industry E Rd. IV Science-Based Industrial Park,Hsinchu 300, Taiwan, R.O.C.
TEL:+886-3-5781970
FAX:+886-3-5644432
https://www.esmt.com.tw
ESMT will join 2023 China International IC Industry and Application Expo (IC Expo)
Date:2023/11/22-11/24
Location:SNIEC (No.2345 Longyang Road, Pudong New Area, Shanghai, China)
Booth No.:1C028


ESMT is pleased to announce its participation in 2023 China International IC Industry and Application Expo (IC Expo) in shanghai , scheduled from 22th Nov. 2023 to 24th Nov. 2023. The exhibition attracts famous companies to present chip core technology and innovated solutions.

ESMT is one of the important leaders in integrated circuit chip industry and have developed diverse applications for a several years. This exhibition will display low power consumption and high performance wireless communication transceiver and SoC ; driving IC for various applications on controlling motor; multi-sensors in one chip for monitoring environmental temperature, humidity and CO2 ; the proximity sensing ICs applied on mobile phone, homing appliance and so on. Also, there are the integrated system and scenario demonstration to perform the advantage and characteristic in order provide diversified solutions in IoT and innovative technology.

You are cordially invited to visit us at SINEC, Hall 1 booth.: 1C028 to explore the possibility ESMT’s product could bring for you. Your presence will surely contribute to our success in this exhibition. We look forward to seeing you there.

ESMT is a publicly-traded, leading fabless IC Design house in Taiwan. ESMT started off 25 years ago as a semiconductor memory supplier offering all types of DRAM and flash memory products, it later diversified to non-memory segments of mixed signal IC, RF IC and sensor IC. ESMT’s current product portfolio has been broadened to include audio IC, power management IC, motor driver IC, RF SoC/transceivers /temperature/light sensors and proximity sensors.

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